Vibration lifetime modelling of PBGA solder joints under random vibration loading
QIN Fei1,BIE Xiaorui1,CHEN Si2,AN Tong1
1.Institute of Electronics Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China;
2.Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China
Abstract：The sinusoidal and random vibration tests of Sn37Pb soldered plastic ball grid array (PBGA) assemblies were conducted to obtain the vibration lifetime of solder joints.A finite element analysis (FEA) was performed to obtain the maximum stresses at critical solder joints.A method was proposed for the vibration lifetime prediction of PBGA solder joints based on vibration failure tests, FEA and an adjusted Steinberg fatigue life prediction model.The results show the model is effective in predicting the fatigue life of solder joints under random vibration condition.The methodology can be applied to provide models and tools for the thermo-mechanical reliability design of PBGA packaging.
