|
|
|
| Analysis and optimization of bending-vibration coupled stress and strain of micro-scale CSP solder joint |
| GAO Chao1, HUANG Chunyue1, LIANG Ying2, FU Yuxiang1, KUANG Bing1 |
1.School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China;
2.School of Electronical Information Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China |
|
|
|
|
Abstract The 3-D finite element model for micro-scale chip scale package (CSP) solder joint was established．The model’s stress and strain simulation analyses were performed under bending-vibration composite loading to analyze effects of solder joint material, diameter and height as well as pad diameter on micro-scale CSP solder joint bending-vibration coupled stress and strain.Taking solder joint diameter and height as well as pad diameter as design variables, 17 sets of solder joint models with combinations of different levels were designed, and the maximum bending-vibration coupled stress of the corresponding solder joint was obtained through calculation.Regression equations for solder joint’s bending-vibration coupled stress and structural parameters were established using the response surface method, and solder joint’s structural parameters were optimized using the particle swarm optimization (PSO) method.The results showed that if solder joint material is SAC387, its bending-vibration coupled stress is the maximum; its maximum bending-vibration coupled stress and strain decrease with increase in solder joint height and pad diameter, and increase with increase in solder joint diameter; the optimal level combination of solder joint structural parameters is composed of solder joint diameter 0.18 mm, solder joint height 0.16 mm, and pad diameter 0.15 mm; after optimization, the maximum bending-vibration coupled stress of CSP solder joint drops by 8.49%.
|
|
Received: 04 March 2020
Published: 15 May 2021
|
|
|
|
［1］杜润.先进的芯片尺寸封装(CSP)技术［J］.电子工业专用设备，2006, 35(9): 36-42.
DU Run. Advanced chip scale package technology［J］.Equipment for Electronic Products Manufacturing, 2006, 35(9): 36-42.
［2］殷芮，黄春跃，黄根信，等.埋入式基板微尺度球栅阵列焊点三点弯曲应力应变分析［J］.焊接学报，2018, 39(8): 23-27.
YIN Rui, HUANG Chunyue, HUANG Genxin, et al.Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending［J］.Transactions of the China Welding Institution, 2018, 39(8): 23-27.
［3］王玲，王宏芹，符永高，等.无铅BGA焊点温度循环及四点弯曲可靠性能试验研究［J］.电子工艺技术，2010, 31(6): 332-333.
WANG Ling, WANG Hongqin, FU Yonggao, et al.Thermal cycling and four-points bending reliable research on lead-free BGA joint［J］.Electronics Process Technology, 2010, 31(6): 332-333.
［4］CHANG G, YU C K, SHAO T, et al.Cyclic bending testing condition effect on the SnAgCu solder interconnects in TFBGA package on board［C］∥Microsystems, Packaging, Assembly & Circuits Technology Conference.Impact International.IEEE,2009.
［5］LAU D, CHAN Y S, LEE S W R, et al.Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis［J］.Equipment for Electronic Products Manufacturing, 2007(3):30-38.
［6］韦何耕，黄春跃.基于模糊理论的随机振动条件下叠层PBGA焊点可靠性分析［J］.焊接学报，2018,39(2):49-52.
WEI Hegeng, HUANG Chunyue.Reliability analysis of laminated PBGA solder joints under random vibration based on fuzzy theory［J］.Transactions of the China Welding Institution, 2018,39(2):49-52.
［7］王红芳，赵玫，陈永国.Flip Chip焊点振动疲劳寿命预测模型［J］.上海交通大学学报，2001,35(12): 1855-1857.
WANG Hongfang, ZHAO Mei, CHEN Yongguo.Vibration fatigue life prediction model for Flip Chip solder joint［J］.Jourual of Shanghai Jiaotong University, 2001,35(12):1855-1857.
［8］KIM Y K, HWANG D S.PBGA packaging reliability assessments under random vibrations for space applications［J］.Microelectronics Reliability,2015,55(1):172-179.
［9］CHEN Y S, WANG C S, YANG Y J.Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components ［J］.Microelectronics Reliability, 2008,48 (4) :638-644.
［10］CHE F X, PANG J H L.Vibration reliability test and finite element analysis for flip chip solder joints［J］.Microelectronics Reliability, 2009, 49(7): 754- 760.
［11］LIU X, SOOKLAL V K, VERGES M A, et al.Experimental study and life prediction on high cycle vibration fatigue in BGA packages ［J］.Microelectronics Reliability, 2006, 46(7):1128- 1138.
［12］黄春跃，韩立帅，梁颖，等.微尺度CSP焊点温振耦合应力应变有限元分析［J］.振动与冲击,2018,37(15):171-178.
HUANG Chunyue, HAN Lishuai, LIANG Ying, et al.Finite-element analysis for temperature-vibration coupled stress and strain of a microscale CSP solder joint［J］.Journal of Vibration and Shock, 2018,37(15):171-178.
［13］刘芳，孟光.随机振动载荷下电路板组件三维有限元模拟［J］.振动与冲击，2012,31(20):61-64.
LIU Fang, MENG Guang.Three-dimension finite element simulation for a PCB assembly under random vibration loading［J］.Journal of Vibration and Shock, 2012,31(20):61-64.
［14］田茹玉，王晨曦，田艳红，等.极限温度下CBGA焊点热冲击疲劳寿命预测［J］.焊接学报，2017, 38(10):93-97.
TIAN Ruyu, WANG Chenxi, TIAN Yanhong, et al.Life prediction of CBGA soldered joints under extreme temperature thermal shock［J］.Transactions of the China Welding, 2017,38(10):93-97.
［15］关挺，钟绍华，周才，等.基于响应面和粒子群算法的悬置多目标优化［J］.物流技术，2017(10): 107-114.
GUAN Ting, ZHONG Shaohua, ZHOU Cai, et al.Multi-objective optimization of cab suspension based on response surface and PSO［J］.Logistics Technology, 2017(10): 107-114. |
|
|
|
