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| Contact threshold of random vibration bonding wire deformation |
| DAI Feng |
| Space Electronic Information Technology Research Institute, Xi’an 710000, China |
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Abstract With the development of high integration and high density of electronic equipment, the spacing of bonding wires inside chips becomes smaller and smaller.In harsh vibration environment, bonding wires may have cross, touch short circuit and other reliability problems.Here, aiming at the short circuit problem of a certain chip bonding wire in practical engineering, the natural frequency of the chip’s bonding wire was obtained with theoretical analysis.Establishing the finite element model was used to study the contact problem caused by bonding wire deformation in random vibration, and the threshold value of the power spectral density of bonding wire contact acceleration was obtained.Finally, the high-speed camera technique was used to do test verification.The results showed that the theoretical and numerical analysis method can accurately obtain the impact contact threshold of bonding wire to provide a reliability criterion for application of bonding wires in vibration environment.
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Received: 20 October 2020
Published: 15 May 2021
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