|
Abstract Three-dimension finite element model was established by using ABAQUS software, and base-motion method was adopted to carry out random power spectrum analysis of PCB assembly. Simulation results show very good correlation with experiment measurement in terms of center displacement responses in actual vibration test, which validated our FEA. The following conclusions are obtained: (1) there is larger peeling stress at the solder joints which locate at the outermost corners of packages. These solder balls at the outermost corners are critical solder joints, and would be very vulnerable to crack. (2) when the fixed screws became loose，the natural frequency of PCB assembly would be decreased, and the root mean square values of the critical solder joints’ peeling stresses would get larger. The bigger the peeling stress of a solder joint is, the more vulnerable the solder joint is. Thus, these critical solder joints would be more easily damaged.
|
|
Received: 20 April 2011
|
|
|
|
2012, Vol. 31 
