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| Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load |
| ZHANG Long, HUANG Chun-yue, HUANG Wei, HUA Jian-wei |
| School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China |
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Abstract Based on Patran software, the 3D finite element models of double-bump solder joints were set up. The natural frequency, vibration mode and frequency response rule of the model were analyzed under the random vibration, the stress and strain distribution and the response curves of strain power spectrum density for the double-bump solder joints were obtained, and then the random vibration fatigue life of the double-bump solder joints were also calculated out based on the power spectrum and rain flow count method; the effect of the pad diameter and the maximum radial diameter for double-bump solder joints on the fatigue life of the double-bump solder joints were analyzed under random vibration. The results obtained from the simulation show that the double-bump solder joint with the height of 0.5mm, the pad diameter of 0.3mm and the maximum radial diameter of 0.4mm has the fatigue life of 3132 hours under random vibration; when the pad diameter increases from 0.2 mm to 0.35mm, the fatigue life of double-bump solder joints increases with the increasing the pad diameter; when the maximum radial diameter of solder joints increases from 0.4mm to 0.55mm, the fatigue life of double-bump solder joints decreases with the increasing the maximum radial diameter.
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Received: 21 April 2016
Published: 15 August 2017
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