微尺度CSP焊点温振耦合应力应变有限元分析

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Abstract

3-D finite element analysis models for micro-scale chip scale package (CSP) solder joints were established. According to the thermal-structural coupling analysis, temperature-vibration coupled analyses were done for models. Stress and strain distributions of micro-scale CSP solder joints were obtained. Stress and strain distributions of micro-scale CSP solder joints were compared with those of conventional scale CSP solder joints. Effects of different solder materials, pad diameter and solder joint volume on stress and strain of micro-scale CSP solder joints were analyzed. The results showed that stress and strain of micro-scale CSP solder joints are larger than those of conventional-scale CSP solder joints under the temperature-vibration coupled condition; The maximum stress of solder joint using material SAC387 is larger than that using material SAC305, 63Sn37Pb and 62Sn36Pb2Ag, respectively; when the maximum diameter of solder joint decreases from 105μm to 80μm, stress and strain of micro-scale CSP solder joints gradually decrease; when pad diameter decreases from 80μm to 60μm, stress and strain of micro-scale solder joints gradually increase.

Key words： micro-scale solder chip scale package (CSP) thermal–vibration coupling stress and strain finite element analysis

Received: 12 December 2016 Published: 28 July 2018

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	Articles by authors
	HUANG Chunyue1
	HAN Lishuai1
	LIANG Ying2
	LI Tianming3
	HUANG Genxin1

Cite this article:

HUANG Chunyue1,HAN Lishuai1,LIANG Ying2, et al. Finite - element analysis for temperature-vibration coupled stress and strain of a microscale CSP solder joint[J]. JOURNAL OF VIBRATION AND SHOCK, 2018, 37(15): 171-178.

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http://jvs.sjtu.edu.cn/EN/ OR http://jvs.sjtu.edu.cn/EN/Y2018/V37/I15/171

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