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| Random vibration simulation analysis and an optimization design of analytical balance packages |
| MI Nannan, LI Guang |
| College of Packaging and Printing Engineering, Tianjin University of Science and Technology, Tianjin 300222, China |
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Abstract The finite element analysis method was used to analyze the modal and random vibration acceleration PSD of analytical balance package to obtain the stress distribution nephogram and the acceleration power spectral density response curve.The multi-objectives optimization design on cushioning pads were performed to obtain the cushioning structure of low cost and high property.The finite element model was established via Solidworks,and the dynamic simulation was done via Ansys Workbench.The deformation and vibration properties of the package in the transportation process were analyzed to find out the weak points of the package.The Optimal design of response surface was conducted the cushioning pad with acceleration,maximum deformation and mass of the package as the objective function.After response surface optimization analysis,the performance of the package was improved.Through the simulation analysis and the optimization design on the analytical balance package,the structure size of cushioning pad can be improved,the breakage rate of the product during transportation can be reduced,and the cushioning structure can be lightweight.
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Received: 12 December 2017
Published: 15 February 2019
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[1] 奚德昌. 包装设计及包装动力学一些问题[J]. 包装工程，1995, (3): 1-4.
XI De-chang. Some problems in packaging design and packaging dynamics[J]. Packaging Engineering, 1995, (3): 1-4.
[2] 陈元龙. 随机激励环境下电子产品防振包装原理研究[D]. 西安：西安理工大学，2008.
CHEN Yuan-long. Research on Anti Vibration Packaging Principle of Electronic Products under Random Excitation Environment [D]. Xi'an: Xi'an University of Technology, 2008.
[3] 李勤建，高翠琢，边国辉. 组件的模态分析和随机振动分析[J]. 半导体技术，2012, (10): 810-814.
LI Qin-jian, GAO Cui-zhuo, BIAN Guo-fei. Modal Analysis and Random Vibration Analysis of Components[J]. Semiconductor technology, 2012(10): 810-814.
[4] Qin S, Li Z, Chen X, et al. Comparing and modifying estimation methods of fatigue life for PCBA under random vibration loading by finite element analysis[C]. Prognostics and System Health Management Conference. IEEE, 2015:1-5.
[5] WANG Z W，ZHANG Y B. Dynamic characteristic analysis of refrigerator-truck transport system by using inverse substructure method[J]. Packaging Technology and Science, 2014,27(11): 883-900.
[6] 巫发茂，蒋 龙，王 健，等. 基于ANSYS Workbench某机载电子设备随机振动响应分析[J]. 现代电子技术， 2016, 39(10): 96-99.
WU Fa-mao, JIANG Long, WANG Jian, et al. Random Vibration Response Analysis of Some Airborne Electronic Equipment Based on ANSYS Workbench[J]. Modern electronic technique, 2016, 39 (10): 96-99.
[7] Xu S, Chen K J, Song F F. Random Vibration Analysis of Grid-Controlled Electron Gun in High Power TWT[J]. Applied Mechanics & Materials, 2013, 423-426: 1511-1515.
[8] 丁玉平，钱 怡. 基于Ansys Workbench的整体包装件动态缓冲特性仿真分析[J]. 包装工程，2014, 35(11): 18-22.
DING Yu-ping, Yi Yi. Analysis of dynamic cushioning property of integral package based on Ansys Workbench[J]. Packaging Engineering, 2014, 35(11): 18-22.
[9] 卢 山，张晓旻. 探空火箭箭头随机振动仿真分析[J]. 兵器装备工程学报，2017, 38(5):73-77.
LU shan, ZHANG Xiao-min. Random vibration simulation analysis of Sounding Rocket Arrows[J]. Journal of Weapon - Equipment Engineering, 2017, 38(5): 73-77.
[10] WANG C C, Li C R, Ma T. Research on the Random Vibration Cumulative Fatigue Damage Life Based on the Finite Element Analysis[J]. Applied Mechanics & Materials, 2013, 300-301: 992-996.
[11] HE X Q, Wang J D, Zhu J H, et al. Fatigue Life Prediction and Verification for HIC Hermetical Sealing under Random Vibration Loading[J]. Applied Mechanics & Materials, 2014, 668-669:176-180.
[12] 王丽丽. 轻武器电子校瞄系统研究[D]. 太原：中北大学，2016.
WANG Li-li. Research on Electronic Aiming System of Light Weapons[D]. Taiyuan: North Central University, 2016.
[13] 吴仕绪. 多功能无弹校枪仪的创新价值[J]. 军事运筹与系统工程，2010 , (3): 40-40.
WU Shi-xu. The Innovative Value of Multifunctional Missile Bomb Gun[J]. Military Operations and Systems Engineering, 2010, (3): 40-40.
[14] 李晓刚. 运输包装系统随机振动频域分析[J]. 包装工程，2012, 33(15): 50-54.
LI Xiao-gang. Random vibration analysis of transport packaging system in frequency domain[J]. Packaging Engineering, 2012, 33(15): 50-54.
[15] Aw K C, Huang W D J, Silva M W R P D. Evaluation of climatic vibration testing on plastic waterproof enclosure for electronic equipment using ANSYS Workbench[J]. Materials & Design, 2007, 28(9): 2505-2510.
[16] 王志伟，林深伟. 随机振动下产品包装件动态响应的实验研究和有限元分析[J]. 振动与冲击，2017, 36(13): 223-229.
WANG Zhi-wei, LIN Shen-wei. Experimental Study and Finite Element Analysis of Dynamic Response of Package under Random Vibration[J]. Vibration and Shock, 2017, 36(13): 223-229.
[17] 喻 斌. 弹载模块电路结构振动分析及优化方法研究[D]. 成都：电子科技大学，2014.
YU Bin. Study on vibration analysis and optimization method of circuit structure of missile-borne module [D]. Chengdu: University of Electronic Science and Technology, 2014.
[18] 申利发. 平板电视缓冲包装性能模拟分析计算[D]. 济南：山东大学，2014.
SHEN Li-fa. Prediction and Calculation of Buffer Packaging Performance of Flat Panel TV [D]. Jinan: Shandong University, 2014.
[19] 王 宇, 卢 玲, 李文韬. 基于Ansys的有限元网格划分方法应用研究[J]. 起重运输机械，2014, (3): 53-56.
WANG Yu, LU Ling, LI Wen-tao. Application of finite element meshing method based on Ansys[J]. Lifting transport machinery, 2014, (3): 53-56.
[20] 许锐敏，潘 骏，等. 筒子染色机染缸碟形封头的可靠性优化设计[J]. 浙江理工大学学报，2014, 31(1): 7-8.
XU Rui-min, PAN Jun, et al. Reliability Optimization Design of Dyeing Machine with Dyeing Machine[J]. Journal of Zhejiang University of Science and Technology, 2014, 31(1): 7-8.
[21] 刘龙涛，李传日，程祺，等. 某结构件的随机振动疲劳分析[J]. 振动与冲击, 2013, 32(21):97-101.
Liu Longtao, Li Chuanri, Cheng Qi, et al. Random vibration fatigue of a structure [J] .Journal of Vibration and Shock, 2013,32 (21): 97-101.
[22] 王志伟，林深伟. 随机振动下产品包装件动态响应的实验研究和有限元分析[J]. 振动与冲击, 2017, 36(13):223-229.
WANG Zhi-Wei, LIN Shen-Wei.Experimental Study and Finite Element Analysis of Dynamic Response of Product Package under Random Vibration [J] .Journal of Vibration and Shock, 2017,36 (13): 223-229.
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