Study on accelerated test for board level solder interconnects reliabilityusing vibration shock loading
LIU Yang 1 ZHANG Hongwu 1 SUN Fenglian 1 ZHOU Zhen 2 QIN Yong 2
1. School of Materials Science and Engineering, Harbin Univ. Sci. & Tech, Harbin 150030; China2. School of Measurement-Control Technology and Communications Engineering, Harbin Univ. Sci. & Tech, Harbin 150030; China
Abstract：An accelerated test was designed for evaluating vibration shock resistance of board level solder interconnects. Vibration was loaded upon PCB in cyclic sinusoidal wave mode with single frequency. Vibrating condition was adjusted to simulate drop impact loading amplitude. Loading intensities was characterized using strain measurements. The solder failure process was recorded with a high speed data acquisition system. Results show that a similar loading intensity of drop impact could be obtained using vibration shock method. The loading repetition frequency of vibration shock is higher than that of drop impact. Solder interconnects appeared fatigue characteristic during accelerated failure test. The accelerated test in this work increased the test efficiency with no failure mode shift. Hence, it could be an alternative method for board level shock reliability evaluation.
2013, Vol. 32 
