Abstract： Under Board Level Drop Test，the effects of solder joint shape (barrel, cylinder, hourglass) on Reliability of BGA Packages were analyzed for the same joint height and the same copper pad size. According different solder joint shape, three of 3D finite element model of BGA packages were created. With conducting reliable analysis of BGA packaging in board-level drop condition, impact acceleration curve is applied to numerical simulation in Input-G method. The results showed that：The maximum bending deformation of PCB board arrived at about 0.1ms during the process of drop test; The solder joint shape has greater effect on reliability of BGA packages under board level drop test; The lifetime of three kinds of solder joint were predicted based on the maximum peeling stress, and it showed that the hourglass solder joint had maximum fatigue life, the next was cylinder solder joint and the least was barrel solder joint, therefore, the hourglass solder joint had excellent properties resistance against drop impact.
杨雪霞;肖革胜;树学峰. 板级跌落冲击载荷下无铅焊点形状对BGA封装可靠性的影响[J]. , 2013, 32(1): 104-107.
Yang Xuexia; Xiao Gesheng; Shu Xuefeng. Effect of solder joint shape on reliability of BGA packages underboard level drop test. , 2013, 32(1): 104-107.
2013, Vol. 32 
