纵弯复合型超声椭圆振动辅助抛光光纤阵列系统设计

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摘要对现有的化学机械抛光工艺难以满足光纤阵列组件高质量和高效率的要求，根据杆件的纵向振动和弯曲振动基本方程，设计了一种纵弯复合超声椭圆振动装置，用于光纤阵列组件的超声椭圆振动辅助化学机械抛光，以提高光纤阵列组建端面的抛光质量和抛光效率。本文设计的纵弯复合超声振动系统实现了36kHz下纵向4阶和弯曲13阶的同频超声振动。振幅测试试验结果表明，超声椭圆振动双向振幅分别为3μm和2.5μm，超声椭圆振动辅助化学机械抛光后的光纤端面粗糙度达到27.58nm。

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关键词 ：超声椭圆振动, 光纤阵列, 有限元分析, 阻抗测试, 化学机械抛光

Abstract：Conventional chemical mechanical polishing process is hard to meet requirements of high quality and high efficiency for fiber array components polishing. Based on basic eqrations for rods’ longitudinal vibration and bending vibration, a longitudinal-bending compound mode ultrasonic elliptical vibration device was designed to conduct ultrasonic elliptical vibration-assisted chemical mechanical polishing fiber array components to improve the polishing quality and polishing efficiency of fiber array component end faces. The designed longitudinal-bending compound mode ultrasonic elliptical vibration system realized a compound mode ultrasonic vibration at the same frequency of 36kHz with a longitudinal 4th mode and a bending 13th mode. The polishing test results showed that the two-direction amplitudes of the realized ultrasonic elliptical vibration are 3μm in longitudinal direction and 2.5μm in lateral direction, the roughness of the polished end face of fiber array components reaches 27.58nm.

Key words： ultrasonic elliptical vibration fiber array FEA impedance chemical mechanical polishing

收稿日期: 2016-06-29 出版日期: 2017-12-15

引用本文:

陈涛1，2，刘德福1，2，严日明1，余青1. 纵弯复合型超声椭圆振动辅助抛光光纤阵列系统设计[J]. 振动与冲击, 2017, 36(24): 242-249.
CHEN Tao 1,2 LIU De–fu 1,2 YAN Ri-ming1 YU Qing1. Design of longitudinal bending compound mode ultrasonic elliptical vibration-assisted fiber array polishing system. JOURNAL OF VIBRATION AND SHOCK, 2017, 36(24): 242-249.

链接本文:

http://jvs.sjtu.edu.cn/CN/ 或 http://jvs.sjtu.edu.cn/CN/Y2017/V36/I24/242

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