轻量化层叠式电子设备的振动分析

摘要
图/表
参考文献(16)
相关文章 (15)

全文: PDF (1639 KB) HTML (1 KB)
输出: BibTeX | EndNote (RIS)

摘要航天电子产品在发射段要经历严酷的力学环境考核。为实现电路板动力学响应结果的准确预测，对影响响应结果的各参数进行了分析。首先，对电路板建模的等效方法进行了分析探讨，明确了“全局均分”的建模方式；其次，根据电路板的动力学响应方程，结合大量试验数据，对影响“全局均分法”分析结果的2个因素进行了统计分析，确定了各因素的合理取值范围；最后，利用“全局均分”的建模方法对某视频箱进行了动力学分析，并与试验结果进行对比。结果表明，分析结果与试验数据的误差在18%以内，满足工程应用要求，能够快速实现电路板动力学响应结果的预测，对相关产品后续设计工作提供参考依据。

	服务

	把本文推荐给朋友
	加入我的书架
	加入引用管理器
	E-mail Alert
	RSS
	作者相关文章

Abstract：Aerospace electronic products have to experience harsh assessment of mechanical environment in launch period. Here, in order to accurately predict dynamic response results of printed circuit boards (PCBs), parameters affecting prediction results were analyzed. Firstly, the equivalence methods for PCB modeling were analyzed and explored to clarify the global mean modeling one. Secondly, according to the dynamic response equation of PCB, using a large amount of test data, statistical analyses were performed for two factors affecting the analysis results of the global mean method to determine the reasonable range of each factor. Finally, the global mean modeling method was used to do dynamic analysis for a video electronic box, and compare the analysis results with test data. Results showed that the error between analysis results and test data is within 18% to meet requirements of engineering application, the proposed method can rapidly realize the prediction of PCB dynamic responses; the proposed method provides a reference for the further design work of corresponding products.

Key words： Stacked Electronic Equipment globally smeared Printed Circuit Board Random Vibration

收稿日期: 2018-04-28 出版日期: 2019-09-28

引用本文:

石进峰王炜夏思宇辛伟. 轻量化层叠式电子设备的振动分析[J]. 振动与冲击, 2019, 38(19): 155-160.
SHI Jinfeng,WANG Wei,XIA Siyu,XIN Wei. Vibration analysis for lightweight and laminated electronic equipment. JOURNAL OF VIBRATION AND SHOCK, 2019, 38(19): 155-160.

链接本文:

http://jvs.sjtu.edu.cn/CN/ 或 http://jvs.sjtu.edu.cn/CN/Y2019/V38/I19/155

[1] Robin Alastair Amy. Accuracy of simplified printed circuit board finite element models[J]. Microelectronics Reliability, 2010,50: 86–97.
[2] G.S. Aglietti. Analysis of Enclosures and Anti Vibration Devices for Electronic Equipment for Space Applications.
[3] 李心洁, 倪修华. PCB安装结构对元器件随机振动响应的影响[J]. 制导与信号，2015, 36(1)：46-50.
LI Xin-Jie, NI Xiu-Hua. The effect of a PCB installation structure on component random vibration response[J]. Guidance & Fuze, 2015, 36(1)：46-50.
[4] Laura P.A.A, Ercoli L. Dynamic Stiffening of a Printed Circuit Board[J]. Acustica, 1995, 81: 196-197.
[5] Wong T L, Stevens K.K, Wang G. Experimental Modal Analysis and Dynamics Response Prediction of PC Boards With Surface Mounted Electronic Components[J]. ASME Journal of Electronic Packaging, 1999, 113: 244-249.
[6] Lim G.H, Ong J.H, Penny J.E.T. Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration[J]. ASME Journal of Electronic Packaging, 1999,121: 122-126.
[7] Ying-Chih Lee, Bor-Tsuen Wang. Finite element model verification for packaged printed circuit board by experimental modal analysis[J]. Microelectronics Reliability, 2008,48: 1837–1846.
[8] Dave.S.Steinberg.王建刚（译）.电子设备振动分析[M]. 第3版. 航空工业出版社, 2012.
Dave.S.Steinberg. WANG Jian-Gang(Translator). Vibration analysis for electronic equipment[M]. Third edition. Aviation industry press, 2012.
[9] Barker DB, Chen YS. Modeling the vibration restraints of wedge lock card guides[J]. Journal of Electronic Packing,1993,115:189-194
[10] J.M.Pitarresi, A.A.Primavera. Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards[J]. Journal of Electronic Packing, 1992,114:378-383.
[11] Robin Alastair Amy, G.S. Aglietti. Simplified modelling of printed circuit boards for spacecraft applications[J]. Acta Astronautica, 2009,65: 192–201.
[12] Robin Alastair Amy, G.S. Aglietti. Sensitivity analysis of simplified Printed Circuit Board finite element models[J]. Microelectronics Reliability, 2008,49: 791–799.
[13] P.Veeramuthuvel, K.K.Sairajan, K.Shankar. Vibration suppression of printed circuit boards using an external particle damper[J]. Journal of Sound and Vibration, 2016,366: 98–116.
[14] 崔海坡, 程恩清. 不同电子封装结构的随机振动分析[J]. 焊接学报，2017,38(7) : 91-94.
CUI Hai-Po, CHENG En-Qing. Random vibration analysis of different electronic packaging structures[J]. Transaction of the china welding institution,2017, 38(7) : 91-94.
[15] 王志伟, 林深伟. 随机振动下产品包装件动态响应的实验研究和有限元分析[J]. 振动与冲击，2017,36(13) : 223-229.
WANG Zhi-Wei, LIN Shen- Wei. Tests and FE analysis for dynamic responses of packaged products under random vibration environment[J]. Journal of vibration and shock, 2017, 36(13): 223-229.
[16] 李林, 王栋, 孔林. 随机振动响应下空间相机支撑结构设计与试验[J]. 振动与冲击，2017,36(10) : 232-236.
LI Lin, WANG Dong, KONG Lin. Design and test of a space camera support structure under random vibration excitation[J]. Journal of vibration and shock, 2017, 36(10): 232-236.