纵弯复合型超声椭圆振动辅助抛光光纤阵列系统设计

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Abstract Conventional chemical mechanical polishing process is hard to meet requirements of high quality and high efficiency for fiber array components polishing. Based on basic eqrations for rods’ longitudinal vibration and bending vibration, a longitudinal-bending compound mode ultrasonic elliptical vibration device was designed to conduct ultrasonic elliptical vibration-assisted chemical mechanical polishing fiber array components to improve the polishing quality and polishing efficiency of fiber array component end faces. The designed longitudinal-bending compound mode ultrasonic elliptical vibration system realized a compound mode ultrasonic vibration at the same frequency of 36kHz with a longitudinal 4th mode and a bending 13th mode. The polishing test results showed that the two-direction amplitudes of the realized ultrasonic elliptical vibration are 3μm in longitudinal direction and 2.5μm in lateral direction, the roughness of the polished end face of fiber array components reaches 27.58nm.

Key words： ultrasonic elliptical vibration fiber array FEA impedance chemical mechanical polishing

Received: 29 June 2016 Published: 15 December 2017

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http://jvs.sjtu.edu.cn/EN/ OR http://jvs.sjtu.edu.cn/EN/Y2017/V36/I24/242

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