Analysis and optimization of bending-vibration coupled stress and strain of micro-scale CSP solder joint
GAO Chao1, HUANG Chunyue1, LIANG Ying2, FU Yuxiang1, KUANG Bing1
1.School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China;
2.School of Electronical Information Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China
Abstract：The 3-D finite element model for micro-scale chip scale package (CSP) solder joint was established．The model’s stress and strain simulation analyses were performed under bending-vibration composite loading to analyze effects of solder joint material, diameter and height as well as pad diameter on micro-scale CSP solder joint bending-vibration coupled stress and strain.Taking solder joint diameter and height as well as pad diameter as design variables, 17 sets of solder joint models with combinations of different levels were designed, and the maximum bending-vibration coupled stress of the corresponding solder joint was obtained through calculation.Regression equations for solder joint’s bending-vibration coupled stress and structural parameters were established using the response surface method, and solder joint’s structural parameters were optimized using the particle swarm optimization (PSO) method.The results showed that if solder joint material is SAC387, its bending-vibration coupled stress is the maximum; its maximum bending-vibration coupled stress and strain decrease with increase in solder joint height and pad diameter, and increase with increase in solder joint diameter; the optimal level combination of solder joint structural parameters is composed of solder joint diameter 0.18 mm, solder joint height 0.16 mm, and pad diameter 0.15 mm; after optimization, the maximum bending-vibration coupled stress of CSP solder joint drops by 8.49%.
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