Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA
LU Liangkun1, HUANG Chunyue1, LIANG Ying2, LI Tianming3
1.School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China;
2.Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technology College, Chengdu 610021, China;
3.Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China
Abstract：The finite element analysis model and the electromagnetic simulation one for chip size package (CSP) solder joint were established.Choosing solder joint diameter, its height and welding pad diameter as design variables, taking CSP solder joint’s random vibration stress and return loss as objectives, 17 sets of solder joint morphological parametric level combinations were designed and modeled to do simulation computation.The response surface (RS) method was used to fit relations among 17 combination sets’ stress values, return loss values and CSP solder joint morphological parameters.The genetic algorithm (GA) was used to do optimization design for fitted functions to obtain CSP solder joint’s optimal random vibration stress values and return loss ones, and reduce its parametric level combination.The optimization results were validated with return loss measurement tests.The results showed that after optimization, the maximum equivalent stress of CSP solder joint drops by 11% while its return loss reduces by 2.78%; the actual measurement tests of return loss verify the correctness of the optimization results.
路良坤1，黄春跃1，梁 颖2，李天明3. 基于响应面-遗传算法的CSP焊点随机振动应力与回波损耗双目标优化设计[J]. 振动与冲击, 2019, 38(21): 221-228.
LU Liangkun1, HUANG Chunyue1, LIANG Ying2, LI Tianming3. Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA. JOURNAL OF VIBRATION AND SHOCK, 2019, 38(21): 221-228.
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