Abstract：The coupling stiffness between the internal modules of electronic equipment has a great impact on its dynamic characteristics. First, the vibration isolation theory of electronic equipment under the coupling condition was introduced. Then, taking the lead fracture of QFP component within an electronic equipment under vibration test as an example, the theoretical analyses of different coupling conditions were carried out, and availability of the vibration isolation theory was verified by finite element modal analysis. Finally, the vibration response of QFP was analyzed, and the fatigue life of component lead under different coupling conditions were calculated based on Palmgren-Miner’s cumulative damage theory, The analysis results were in good agreement with the product environmental test.
付永辉，王琼皎，董锋，刘江涛. 电子设备耦合刚度对QFP器件振动可靠性的影响[J]. 振动与冲击, 2023, 42(22): 204-209.
FU Yonghui,WANG Qiongjiao,DONG Feng,LIU Jiangtao. Effects of electronic equipment coupling stiffness on the reliability of the QFP component of an electronic equipment under vibration. JOURNAL OF VIBRATION AND SHOCK, 2023, 42(22): 204-209.
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