PBGA组件的动态特性仿真与实验研究

杨平 陈子夏 谭广斌

振动与冲击 ›› 2009, Vol. 28 ›› Issue (3) : 168-170.

PDF(1195 KB)
PDF(1195 KB)
振动与冲击 ›› 2009, Vol. 28 ›› Issue (3) : 168-170.
论文

PBGA组件的动态特性仿真与实验研究

  • 杨平 陈子夏 谭广斌
作者信息 +

Dynamic Simulation and experiments of PBGA Assembly

  • YANG Ping、CHEN Zi-xia、TAN Guang-bin
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文章历史 +

摘要

为了得到振动条件下塑料球栅阵列封装(PBGA)芯片在PCB板上焊接位置以及PCB加固方式对动态特性的影响,本文设计制作了一块包含不同结构和材料参数的PBGA组件样品,首先采用ANSYS软件建立PCB组件的有限元模型,在建模过程中采用了简化PBGA结构和减少焊点数量的方法减小计算量,通过模拟计算得到了该组件样品在不同加固条件下的一阶频率与模态变形。然后结合模态实验的方法进行了不同边界条件下的动态测试分析。运用模态分析方法获得了各加固条件下的模态参数。最后以边四点加固方式为例,比较了仿真与试验的相互匹配性与差异性。分析结果表明:芯片分布在四点固定板上、增加约束数目、靠近约束点布片可以有效改善动态特性

Abstract

In order to obtain the influence of chip position and fix methods to dynamic property of Plastic Ball Grid Array (PBGA) under vibration environment. In this paper, a group of specified PBGA assembly chips which contain different structure and material parameters are designed and produced. ANSYS is used to build up the finite element model. In modeling process, simplified PBGA structure accompanied with numbers of solder joints are utilized to decrease the calculation. From simulation, 1st frequency and deformation can be achieved under different fixed ways. Experimental modal analysis method is combined with the dynamic test under different consolidations. Finally, take Side Four-points fixed way as an example to compare the correspondence and difference between the simulation and test. Results show the ways like make the chips on four-point board; increase the constraints; make chips near the constrains can well improve the dynamic property.

Key words

PBGA (Plastic Ball Grid Array) chips / Dynamic Simulation / Model Test / Analysis / Anti-vibration Optimization

引用本文

导出引用
杨平 陈子夏 谭广斌 . PBGA组件的动态特性仿真与实验研究[J]. 振动与冲击, 2009, 28(3): 168-170
YANG Ping;CHEN Zi-xia;TAN Guang-bin. Dynamic Simulation and experiments of PBGA Assembly[J]. Journal of Vibration and Shock, 2009, 28(3): 168-170

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