1. School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001,China;2. School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001,China)
Multi wire saw is a new force in semiconductor wafer processing industry, and becomes the most advanced processing method in silicon slicing with unique advantages. The dynamic performance of machine structure directly relates to the quality of material processing. To ensure the stability of machine tool operation, dynamic performance of machine tool entity was studied and research rationality of mechanical structures. Establish the three-dimensional machine body structure model. Apply finite element method to solve modal based on ANSYS software, natural frequency and mode shapes were calculated. Analyze vibration characteristics of mechanical systems by using dynamics analysis software ADAMS. Frequency responses of key components were obtained in machine tool. Make theoretical judgment on correctness of the mechanism design, and pointed out the direction for further improvement. The results benefit of improving the design of multi wire saw and improving the slicing quality.