摘要
利用有限元软件ABAQUS建立了电路板组件的三维有限元模型，采用基础激励法对电路板组件进行随机功率谱分析。将模拟获得的电路板组件中心位移与实验测得的位移响应的功率谱密度和均方根值进行比较，校验该模型的正确性与模拟结果的有效性。由数值模拟分析可知：(1)球栅阵列封装外围4个拐角处焊点拉应力最大，是关键焊点；(2)固定电路板组件的螺钉变松将使电路板组件的固有频率变小时，关键焊点的拉应力均方根值会增加，焊点越容易失效。
Abstract
Three-dimension finite element model was established by using ABAQUS software, and base-motion method was adopted to carry out random power spectrum analysis of PCB assembly. Simulation results show very good correlation with experiment measurement in terms of center displacement responses in actual vibration test, which validated our FEA. The following conclusions are obtained: (1) there is larger peeling stress at the solder joints which locate at the outermost corners of packages. These solder balls at the outermost corners are critical solder joints, and would be very vulnerable to crack. (2) when the fixed screws became loose，the natural frequency of PCB assembly would be decreased, and the root mean square values of the critical solder joints’ peeling stresses would get larger. The bigger the peeling stress of a solder joint is, the more vulnerable the solder joint is. Thus, these critical solder joints would be more easily damaged.
关键词
随机振动 /
电路板组件 /
焊点 /
有限元模拟
{{custom_keyword}} /
Key words
random vibration /
PCB assembly /
solder joint /
finite element simulation
{{custom_keyword}} /
刘芳 孟光.
随机振动载荷下电路板组件三维有限元模拟[J]. 振动与冲击, 2012, 31(20): 61-64
Liu Fang Meng Guang.
Three-dimension finite element simulation of PCB assembly under random vibration loading[J]. Journal of Vibration and Shock, 2012, 31(20): 61-64
{{custom_sec.title}}
{{custom_sec.title}}
{{custom_sec.content}}
{{custom_fnGroup.title_cn}}
脚注
{{custom_fn.content}}
PDF(1668 KB)
