为满足保证键合头动态特性、避免共振条件下达到结构轻量化设计要求，提出基于灵敏度计算参数优选及基于层次分析法最优解提取相结合的多目标优化设计方法。通过有限元仿真计算与模态实验结合研究键合头动态特性验证有限元模型精度。针对拾取臂部件设计参数进行灵敏度分析并提取优化设计变量。用多目标遗传优化算法对拾取臂以一阶固有频率、结构质量为目标优化计算，用层次分析法优选出最佳优化方案。结果表明，优化后拾取臂一阶固有频率提高27.1%，结构质量减轻8.9%，且键合头已避开共振频段达到设计要求。该研究方法具有较高的精度及应用价值。
Abstract
Flip chip bonding head (FCBR) is a core function component of microelectronic flip chip bonding equipment used to deal with the process of chip picking, dispensing, and bonding. In order to meet the dynamic characteristics of bonding head and avoid resonance phenomenon and to meet the structure lightweight design requirement, in this paper, the multi-objective optimization design method is proposed by combining design parameter filtration based on sensitivity analysis and optimal solution extraction based on Analytic Hierarchy Process (AHP). The dynamic characteristic is investigated by finite element simulating calculation and modal experiment test. The precision of finite element model is verified. The optimization design variables are extracted by parameter sensitivity calculation. The first order inherent frequency and structure mass of picking arm are as the optimization objective. The best optimization solution is selected by using AHP. The results show that the first order inherent frequency of picking arm is enhanced by 27.1% and the mass decreased by 8.9%. Therefore, the research methods have higher precision and application value.
关键词
倒装键合头 /
动态特性 /
模态实验 /
参数灵敏度 /
层次分析法 /
多目标优化
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Key words
flip chip bonding head (FCBR) /
dynamic characteristic /
modal experiment /
parameter sensitivity /
analytic hierarchy process (AHP) /
multi-objective optimization design
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