建立了光互连模块有限元分析模型并进行随机振动加载有限元分析,获取了垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser, VCSEL)与耦合元件间的对准偏移;采用水平正交表设计了不同焊点结构参数组合并建立有限元模型,获取了对准偏移数据并进行方差分析。结果表明:在随机振动加载后,光互连模块VCSEL与耦合元件间会产生水平、垂直、轴向的偏移;陶瓷基板焊点高度、VCSEL焊点高度对对准偏移具有高度显著性影响;因素显著性排序由大到小依次为:陶瓷基板焊点高度、VCSEL焊点高度、陶瓷基板焊点体积和VCSEL焊点体积; 单因子分析表明VCSEL与耦合元件对准偏移值随陶瓷基板焊点高度增加而增大,随VCSEL焊点高度增加而增大。
Abstract
A finite element model of optical interconnect module was established. The position offset between VCSEL and coupling element was obtained after finite elements analysis under random vibration loading. Different solder shape parameter combinations was designed through orthogonal experiment design and used to establish finite element model. The range analysis was performed based on the alignment offsets of corresponding solder shape parameters. The results show that random vibration load caused horizontal, vertical and axial alignment offsets between VCSEL and couple element. Both the height of ceramic substrate solder joint and VCSEL solder joint have significant effect on the alignment offsets. The four factor sort in descending order form the height of ceramic substrate solder joint, the height of VCSEL solder joint, the volume of ceramic substrate solder joint and the volume of VCSEL solder joint by their significance of factor to the alignment offset. Single factor analysis results show the alignment offset increases with the adding of ceramic substrate solder joint height or VCSEL solder joint height.
关键词
光互连模块 /
对准偏移 /
耦合效率 /
随机振动加载 /
有限元分析
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Key words
Optical interconnection module /
Alignment offset /
Couple efficiency /
Variance analysis /
Finite element analysis.
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参考文献
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