基于Patran及频域分析的叠层焊点随机振动可靠性分析

张 龙,黄春跃,黄 伟,华建威

振动与冲击 ›› 2017, Vol. 36 ›› Issue (16) : 202-206.

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振动与冲击 ›› 2017, Vol. 36 ›› Issue (16) : 202-206.
论文

基于Patran及频域分析的叠层焊点随机振动可靠性分析

  • 张 龙,黄春跃,黄 伟,华建威
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Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load

  •  ZHANG Long, HUANG Chun-yue, HUANG Wei, HUA Jian-wei
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文章历史 +

摘要

基于Patran软件建立了叠层焊点三维有限元分析模型,分析了随机振动条件下叠层焊点的固有频率、振型和频率响应规律,获得了叠层焊点应力应变分布和应变功率谱密度响应曲线,并基于功率谱和雨流计数法计算出了叠层焊点振动疲劳寿命;分析了焊盘直径和焊点最大径向直径对叠层焊点随机振动寿命影响。仿真结果表明:在叠层焊点高0.5mm、焊盘直径0.3mm和焊点径向最大直径0.4mm时其随机振动疲劳寿命为3132小时;当焊盘直径从0.2mm增加到0.35mm时,叠层焊点振动疲劳寿命随焊盘直径增大而增大;当焊点最大径向直径从0.4mm增加到0.55mm时,叠层焊点振动疲劳寿命随焊点最大径向直径增大而减少。

Abstract

Based on Patran software, the 3D finite element models of double-bump solder joints were set up. The natural frequency, vibration mode and frequency response rule of the model were analyzed under the random vibration, the stress and strain distribution and the response curves of strain power spectrum density for the double-bump solder joints were obtained, and then the random vibration fatigue life of the double-bump solder joints were also calculated out based on the power spectrum and rain flow count method; the effect of the pad diameter and the maximum radial diameter for double-bump solder joints on the fatigue life of the double-bump solder joints were analyzed under random vibration. The results obtained from the simulation show that the double-bump solder joint with the height of 0.5mm, the pad diameter of 0.3mm and the maximum radial diameter of 0.4mm has the fatigue life of 3132 hours under random vibration; when the pad diameter increases from 0.2 mm to 0.35mm, the fatigue life of double-bump solder joints increases with the increasing the pad diameter; when the maximum radial diameter of solder joints increases from 0.4mm to 0.55mm, the fatigue life of double-bump solder joints decreases with the increasing the maximum radial diameter.
 

关键词

随机振动 / 叠层焊点 / 功率谱 / 疲劳寿命 / 有限元分析

Key words

 random vibration / double-bump solder joint / power spectrum / fatigue life / finite element analysis

引用本文

导出引用
张 龙,黄春跃,黄 伟,华建威. 基于Patran及频域分析的叠层焊点随机振动可靠性分析[J]. 振动与冲击, 2017, 36(16): 202-206
ZHANG Long, HUANG Chun-yue, HUANG Wei, HUA Jian-wei. Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load[J]. Journal of Vibration and Shock, 2017, 36(16): 202-206

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