正矢波激励下简支印制电路板的跌落响应研究

陈思佳1,许富华1,2,阮丽1,卢富德1,高德1

振动与冲击 ›› 2017, Vol. 36 ›› Issue (4) : 203-207.

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振动与冲击 ›› 2017, Vol. 36 ›› Issue (4) : 203-207.
论文

正矢波激励下简支印制电路板的跌落响应研究

  • 陈思佳1,许富华1,2,阮丽1,卢富德1,高德1
作者信息 +

Dropping response of simple supported PCB under versine stimulation

  • CHEN Sijia1,XU Fuhua1,2,RUAN Li1,LU Fude1,GAO De1
Author information +
文章历史 +

摘要

对印刷电路板(PCB)的跌落响应进行了研究,将一对边固定一对边自由的电路板简化为简支梁,建立了其在正矢波脉冲激励下的动力学模型。利用SY11-100气压驱动垂直冲击试验台搭建跌落试验,测得电路板跌落时的脉冲激励以及电路板中心位置的加速度响应,通过与试验结果的对比验证所建动力学模型的正确性。在此基础上,对正矢波脉冲激励的周期以及PCB的材料结构属性对跌落冲击产生的最大应力的影响进行了分析。计算结果表明:电路板跌落冲击产生的最大应力以及达到最大应力所需的时间都与正矢波脉冲激励周期成正比,与材料结构参数λ成反比。

Abstract

Dropping impact response of PCB is studied in this work. The PCB is simplified as a simple supported beam and the dynamic model of the PCB under versine stimulation was also proposed. To validate the dynamic model,a dropping experiment was performed by SY11-100 vertical impact testing station. The pulse excitation and the acceleration response of the PCB were measured to compare with the result of the theoretical calculation. It is found that the period of the versine pulse stimulation and the material of the PCB have great influences on the dynamic response of the PCB. The results show that: the time to reach the maximum stress and the maximum stress of the PCB are both reduced as the period of the versine pulse becomes short and the material structure factor λ increases.

关键词

印制电路板 / 正矢脉冲 / 跌落冲击 / 动力学建模

Key words

printed circuit board / versine pulse / dropping impact / dynamic modeling

引用本文

导出引用
陈思佳1,许富华1,2,阮丽1,卢富德1,高德1. 正矢波激励下简支印制电路板的跌落响应研究[J]. 振动与冲击, 2017, 36(4): 203-207
CHEN Sijia1,XU Fuhua1,2,RUAN Li1,LU Fude1,GAO De1 . Dropping response of simple supported PCB under versine stimulation[J]. Journal of Vibration and Shock, 2017, 36(4): 203-207

参考文献

[1] Tee T Y,Ng H S, Pan S. Board level solder joint reliability modeling of TFBGA package[C]. Proceedings of ICEP Conference. 2002, 491-7.
[2] Darveaux R. Effect of simulation methodology on solder joint crack growth correlation[C]. Proceedings of 50th Electronic Components and    Technology Conference , 2000,1048-58.
[3] Tee T Y, Sivakumar K, Do-Bento-Vieira A. Board level solder joint reliability modeling of TFBGA package[C]. Proceedings of 2nd EMAP Conference. 2000, 51-4.
[4] 高德,卢富德. 聚乙烯缓冲材料多自由度跌落包装系统优化设计[J]. 振动与冲击,2012,31(3):69-72.
GAO De, LU Fu-de. Optimization design of MDOF package cushioning system made of polyethylene[J]. Journal of Vibration and Shock.2015.31(3):69-72.
[5] 张炜,薛飞,卢富德. 考虑易损件物品-EPE缓冲系统冲击响应分析[J].振动与冲击, 2015,34(9):116-119.
ZHEANG Wei, XUE Fei, LU Fu-de, GAO De. Impact-response analysis of the system composed of critical component and EPE cushion[J].Journal of Vibration and Shock.2015.34(9):116-119.
[6]  J.M.Pitarresi,Phil Geng,Willern Bltman et. Dynamic Modeling and Measurement of Personal Computer Motherboard[C]. IEEE Electronic Component and Technology Conference. 2002: 597-603.
[7] T.Y.Tee,H.S.Ng,C.T.Lim et. Drop Test and Impact Life Prediction Model for QFN Packages[J]. Journal SMT. 2003.3 (16):31-39.
[8] E.H. Wong. Dynamic of Board-Level Drop Impact[J]. Transactions of the ASME, Journal of     Electronic Packaging, 2005,127:496-502.
[9]  E.H. Wong , Y.W. Mai, Seah S k W. Board Level Drop Impact-Fundamental and Parametric Analysis[J]. Transactions of the ASME, Journal of Electronic Packaging, 2005,127:496-502.
[10] Suhir E. Could shock tests adequately mimic   drop test conditions[J]. Transactions of the ASME, Journal of Electronic Packaging, 2002, 124:170-177.
[11] Tsai T-Y,Yeh C-L,Lai Y-S.Response Spectra Analysis for Undamped Structural Systems Subjected to Half-sine Impact Acceleration Pulses[J]. Microelectronics Reliability, 2007,47: 1239–1245.
[12]张波,丁汉,盛鑫军. 板级电子封装在跌落冲击载荷下的动态响应分析[J].振动与冲击,  2008,,27(6):108-113.
ZHANG Bo, DING Han, SHENG Xin-jun. Dynamic Response of a Board Level Electronic Package Under Drop Impact Load[J]. Journal of Vibration and Shock, 2008,27(6):108-113.
[13]刘芳,孟光. 电路板组件板级跌落冲击动力学分析[J]. 机械强度,2007,29(5):713-716.
LIU Fang, MENG Guang. Dynamic Analysis of Printed Circuit Board Assembly Subjected to Drop Impact [J]. Journal of Mechanical Strength, 2007,29(5):713-716.
[14]杨雪霞,肖革胜,树学峰. 板级跌落冲击载荷下无铅焊点形状对BAG封装可靠性的影响[J].振动与冲击,2013,32(1):104-107.
Yang Xue-xia, Xiao Ge-sheng, Shu Xue-feng. Effect of Solder Joint Shape on Reliability of BGA Packages Under board Level Drop Test[J]. Journal of Vibration and Shock,2013,32(1):104-107.
[15]Singiresu,S.R.机械振动[M],北京:清华大学出版社,2009.
Singiresu S R. Mechanical Vibration[M]. Beijing: Tsinghua University Press, 2009.
[16]李惠彬. 振动理论与工程应用[M]. 北京:北京理工大学出版社,2006.
LI Huibin. Vibration Theory and Engineering Applications[M]. Beijing: Beijing Institute of Technology Press,2006.
[17]彭国勋. 物流运输包装设计[M].北京:印刷工业出版社,2006.
PENG Guoxun. Logistics Packaging Design[M]. Beijing: Printing Industry Press,2006.

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