PDF(1851 KB)
PDF(1851 KB)
PDF(1851 KB)
超声振动辅助固结磨粒抛光硅片表面形貌及粗糙度研究
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}Investigation of silicon wafer surface morphology and roughness processed by fixed abrasive polishing with assistance of ultrasonic vibration
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