建立了微尺度芯片尺寸封装（chip scale package，CSP）焊点三维有限元模型，对其进行了弯振复合加载应力应变仿真分析。分析了焊点材料、焊点直径、焊点高度和焊盘直径对微尺度CSP焊点弯振耦合应力应变的影响；选取焊点直径、焊点高度和焊盘直径为设计变量，设计了17组不同水平组合的焊点模型并获取了相应焊点最大弯振耦合应力，采用响应曲面法建立了焊点弯振耦合应力与焊点结构参数的回归方程，结合粒子群算法对焊点结构参数进行了优化。结果表明：焊点材料为SAC387时弯振耦合应力最大，最大弯振耦合应力应变随焊点高度和焊盘直径增大而减小、随焊点直径增大而增大；最优焊点结构参数水平组合为焊点直径0.18 mm、焊点高度0.16 mm和焊盘直径0.15 mm；优化后CSP焊点最大弯振耦合应力下降了8.49%。
Abstract
The 3-D finite element model for micro-scale chip scale package (CSP) solder joint was established．The model’s stress and strain simulation analyses were performed under bending-vibration composite loading to analyze effects of solder joint material, diameter and height as well as pad diameter on micro-scale CSP solder joint bending-vibration coupled stress and strain.Taking solder joint diameter and height as well as pad diameter as design variables, 17 sets of solder joint models with combinations of different levels were designed, and the maximum bending-vibration coupled stress of the corresponding solder joint was obtained through calculation.Regression equations for solder joint’s bending-vibration coupled stress and structural parameters were established using the response surface method, and solder joint’s structural parameters were optimized using the particle swarm optimization (PSO) method.The results showed that if solder joint material is SAC387, its bending-vibration coupled stress is the maximum; its maximum bending-vibration coupled stress and strain decrease with increase in solder joint height and pad diameter, and increase with increase in solder joint diameter; the optimal level combination of solder joint structural parameters is composed of solder joint diameter 0.18 mm, solder joint height 0.16 mm, and pad diameter 0.15 mm; after optimization, the maximum bending-vibration coupled stress of CSP solder joint drops by 8.49%.
关键词
微尺度CSP焊点 /
复合加载 /
响应面 /
粒子群算法 /
弯振应力应变
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Key words
micro-scale CSP solder joint /
composite loading /
response surface /
particle swarm optimization (PSO) method /
bending-vibration coupled stress and strain
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