板级跌落冲击载荷下无铅焊点形状对BGA封装可靠性的影响

杨雪霞;肖革胜;树学峰

Effect of solder joint shape on reliability of BGA packages underboard level drop test

Yang Xuexia; Xiao Gesheng; Shu Xuefeng

. 2013, (1): 104 -107 .