随机振动加载条件下焊点形态参数对板级光互连模块对准偏移影响分析
黄春跃1，吴 松1，梁 颖2，李天明3，郭广阔1，熊国际1，唐文亮1
Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load
HUANG Chun-yue1, WU Song1, LIANG Ying2, LI Tian-ming3, GUO Guang-kuo1, XIONG Guo-ji1, TANG Wen-liang1
振动与冲击
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2015, (19): 198
-202
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