基于Patran及频域分析的叠层焊点随机振动可靠性分析
张 龙，黄春跃，黄 伟，华建威
Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load
ZHANG Long, HUANG Chun-yue, HUANG Wei, HUA Jian-wei
振动与冲击
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2017, (16): 202
-206
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