微尺度CSP焊点温振耦合应力应变有限元分析
黄春跃1，韩立帅1，梁颖2，李天明3，黄根信1
Finite - element analysis for temperature-vibration coupled stress and strain of a microscale CSP solder joint
HUANG Chunyue1, HAN Lishuai1, LIANG Ying2,LI Tianming3,HUANG Genxin1
振动与冲击
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2018, (15): 171
-178
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