超声振动辅助固结磨粒抛光硅片表面形貌及粗糙度研究

付鹏1 杨卫平1 吴勇波2

Investigation of silicon wafer surface morphology and roughness processed by fixed abrasive polishing with assistance of ultrasonic vibration

FU Peng1, YANG Weiping1, WU Yongbo2

振动与冲击 . 2018, (24): 237 -243 .