Three-dimension finite element simulation of PCB assembly under random vibration loading

Liu Fang Meng Guang

Journal of Vibration and Shock ›› 2012, Vol. 31 ›› Issue (20) : 61-64.

PDF(1668 KB)
PDF(1668 KB)
Journal of Vibration and Shock ›› 2012, Vol. 31 ›› Issue (20) : 61-64.
论文

Three-dimension finite element simulation of PCB assembly under random vibration loading

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 31(20): 61-64

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1668 KB)

Accesses

Citation

Detail
Sections
Recommended
Copyright © Journal of Vibration and Shock, All Rights Reserved.
Tel: 021-62821366　
E-mail：jvs@sjtu.edu.cn
Powered by Beijing Magtech Co. Ltd.

/

〈 〉