
Separation Process and Shock Analysis of Clamp Band Systems based on LS-DYNA
WU Xin-feng;Liu Guan-ri;LEI Yong-jun;SONG Bao-yong;WANG Shuai;YU Bing
Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (24) : 174-179.
Separation Process and Shock Analysis of Clamp Band Systems based on LS-DYNA
The explicit nonlinear analysis method was applied to solve the separation process and shock analysis of clamp band systems. Finite element and pre-tension force modeling methods were present, and then the dynamic envelope of clamp band and separation shock responses were obtained using LS-DYNA. The effects of interface rings’ stiffness, shearing lips, stiffness factors of kick-off spring and pulling spring on the separation shock response were analyzed, while a single degree ‘spring-mass’ system was utilized to simulate the release process. It indicates that: (1) the approach proposed in this paper can be used to solve both the simulation of separation process and shock analysis of clamp band systems; (2) the separation shock can be reduced by increasing interface rings’ stiffness, appropriate height of shearing lips, decreasing the stiffness factors of kick-off spring and pulling spring. (3) The delay of the release time will reduce the max shock response and the relative frequency.
Clamp band system / explicit nonlinear analysis / dynamic envelope / separation shock {{custom_keyword}} /
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