A novel multidirectional-sensitive MEMS inertial switch by non-silicon surface micromachining

ZHU Bin;YANG Zhuo-qing;CHEN Wen-guo;DING Gui-fu;ZHAO Xiao-lin

Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (5) : 104-107.

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PDF(1837 KB)
Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (5) : 104-107.
论文

A novel multidirectional-sensitive MEMS inertial switch by non-silicon surface micromachining

  • ZHU Bin, YANG Zhuo-qing, CHEN Wen-guo, DING Gui-fu, ZHAO Xiao-lin
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Abstract

Based on non-silicon surface micromachining technology, a new novel three-dimension micro inertial switch with multidirectional-sensitive has been designed and fabricated. Using typical mass spring damper system, the switch mainly consists of mobile electrode (mass) with beam spring, flexible fixed planar and vertical electrodes. By finite element analysis (FEA) simulation, modal analysis of the device has been using to determine the natural frequency of the device; dynamic simulation of the device to verify the working principle. After fabrication, micro-switches are tested by using drop weight. The results show that the threshold accelerations distribute between 50g and 60g, which basically fulfils the expected 60g; and the response time to 1ms half-sine waved shock is above 40 s.

Key words

inertial switch / MEMS / multidirectional-sensitive

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ZHU Bin;YANG Zhuo-qing;CHEN Wen-guo;DING Gui-fu;ZHAO Xiao-lin. A novel multidirectional-sensitive MEMS inertial switch by non-silicon surface micromachining[J]. Journal of Vibration and Shock, 2013, 32(5): 104-107
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