Defects Detection for Flip Chip Using Modal Analysis

ZENG Miao LIAO Guanglan ZHANG Xuekun LIU Junchao SHI Tielin

Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (6) : 24-28.

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Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (6) : 24-28.
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Defects Detection for Flip Chip Using Modal Analysis

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 32(6): 24-28

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