
Defects Detection for Flip Chip Using Modal Analysis
ZENG Miao LIAO Guanglan ZHANG Xuekun LIU Junchao SHI Tielin
Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (6) : 24-28.
Defects Detection for Flip Chip Using Modal Analysis
Flip chip / defects detection / solder bump missing / vibration model / modal analysis / natural frequency {{custom_keyword}} /
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