Study on accelerated test for board level solder interconnects reliabilityusing vibration shock loading

LIU Yang ZHANG Hongwu SUN Fenglian ZHOU Zhen QIN Yong

Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (7) : 74-77.

PDF(1967 KB)
PDF(1967 KB)
Journal of Vibration and Shock ›› 2013, Vol. 32 ›› Issue (7) : 74-77.
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Study on accelerated test for board level solder interconnects reliabilityusing vibration shock loading

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 32(7): 74-77

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