Multi-objective optimization of bonding head based on sensitivity and analytic hierarchy process

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Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (16) : 128-134.

GONG Wen-feng1, 2，HUANG Mei-fa2，ZHANG Mei-ling1，MO Qiu-yun1

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Abstract

Flip chip bonding head (FCBR) is a core function component of microelectronic flip chip bonding equipment used to deal with the process of chip picking, dispensing, and bonding. In order to meet the dynamic characteristics of bonding head and avoid resonance phenomenon and to meet the structure lightweight design requirement, in this paper, the multi-objective optimization design method is proposed by combining design parameter filtration based on sensitivity analysis and optimal solution extraction based on Analytic Hierarchy Process (AHP). The dynamic characteristic is investigated by finite element simulating calculation and modal experiment test. The precision of finite element model is verified. The optimization design variables are extracted by parameter sensitivity calculation. The first order inherent frequency and structure mass of picking arm are as the optimization objective. The best optimization solution is selected by using AHP. The results show that the first order inherent frequency of picking arm is enhanced by 27.1% and the mass decreased by 8.9%. Therefore, the research methods have higher precision and application value.

Key words

flip chip bonding head (FCBR) / dynamic characteristic / modal experiment / parameter sensitivity / analytic hierarchy process (AHP) / multi-objective optimization design

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GONG Wen-feng1, 2，HUANG Mei-fa2，ZHANG Mei-ling1，MO Qiu-yun1. Multi-objective optimization of bonding head based on sensitivity and analytic hierarchy process[J]. Journal of Vibration and Shock, 2015, 34(16): 128-134

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