Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load
HUANG Chun-yue1, WU Song1, LIANG Ying2, LI Tian-ming3, GUO Guang-kuo1, XIONG Guo-ji1, TANG Wen-liang1
Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (19) : 198-202.
Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 | 〉 |