Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load

HUANG Chun-yue1, WU Song1, LIANG Ying2, LI Tian-ming3, GUO Guang-kuo1, XIONG Guo-ji1, TANG Wen-liang1

Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (19) : 198-202.

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PDF(1289 KB)
Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (19) : 198-202.

Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 34(19): 198-202

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