Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load

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Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (19) : 198-202.

HUANG Chun-yue1, WU Song1, LIANG Ying2, LI Tian-ming3, GUO Guang-kuo1, XIONG Guo-ji1, TANG Wen-liang1

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Abstract

A finite element model of optical interconnect module was established. The position offset between VCSEL and coupling element was obtained after finite elements analysis under random vibration loading. Different solder shape parameter combinations was designed through orthogonal experiment design and used to establish finite element model. The range analysis was performed based on the alignment offsets of corresponding solder shape parameters. The results show that random vibration load caused horizontal, vertical and axial alignment offsets between VCSEL and couple element. Both the height of ceramic substrate solder joint and VCSEL solder joint have significant effect on the alignment offsets. The four factor sort in descending order form the height of ceramic substrate solder joint, the height of VCSEL solder joint, the volume of ceramic substrate solder joint and the volume of VCSEL solder joint by their significance of factor to the alignment offset. Single factor analysis results show the alignment offset increases with the adding of ceramic substrate solder joint height or VCSEL solder joint height.

Key words

Optical interconnection module / Alignment offset / Couple efficiency / Variance analysis / Finite element analysis.

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HUANG Chun-yue1, WU Song1, LIANG Ying2, LI Tian-ming3, GUO Guang-kuo1, XIONG Guo-ji1, TANG Wen-liang1. Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset under random vibration load[J]. Journal of Vibration and Shock, 2015, 34(19): 198-202

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