The Finite Element Model Updating of Printed Circuit Board Assembly Based on Response Surface Methodology

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Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (22) : 42-46.

WANG Kai-shan1 LI Chuan-ri1 PANG Yue-chan1 GUO Heng-hui1

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Abstract

On the premise of taking the materials of the printed circuit board and component as orthotropic, a method based on response surface was proposed to update the finite element model(FEM) of printed circuit board assembly(PCBA). The parameters which have great influence on the modal frequencies of PCBA were screened out and taken as the updating parameters by correlation analysis. The sample points were acquired by using an appropriate experimental design according to the number of the updating parameters to construct the polynomial response surface model. The least squares method was used to determine the polynomial coefficients and then to test the fitting accuracy of response surface. The absolute value of error between the results of the calculated response surface and the actual test was taken as the objective function. The optimized parameters were obtained by iterative calculation of MOGA. The updated model was then obtained by substituting optimized parameters into the non-updated FEM．Take the PCBA of an aircraft electronic product as an example. The comparison of modal frequencies of non-updated and updated FEM shows that the relative error of modal frequencies between the updated FEM and the actual test obviously reduced and thus verifies the effectiveness of the model updating methodology suggested in the paper．

Key words

orthotropic / PCBA / model updating / correlation analysis / response surface methodology / optimization

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WANG Kai-shan1 LI Chuan-ri1 PANG Yue-chan1 GUO Heng-hui1. The Finite Element Model Updating of Printed Circuit Board Assembly Based on Response Surface Methodology[J]. Journal of Vibration and Shock, 2015, 34(22): 42-46

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