The Finite Element Model Updating of Printed Circuit Board Assembly Based on Response Surface Methodology

WANG Kai-shan1 LI Chuan-ri1 PANG Yue-chan1 GUO Heng-hui1

Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (22) : 42-46.

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PDF(1089 KB)
Journal of Vibration and Shock ›› 2015, Vol. 34 ›› Issue (22) : 42-46.

The Finite Element Model Updating of Printed Circuit Board Assembly Based on Response Surface Methodology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 34(22): 42-46

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