Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load

ZHANG Long, HUANG Chun-yue, HUANG Wei, HUA Jian-wei

Journal of Vibration and Shock ›› 2017, Vol. 36 ›› Issue (16) : 202-206.

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Journal of Vibration and Shock ›› 2017, Vol. 36 ›› Issue (16) : 202-206.

Study on Reliability of Double-bump Solder Joints Based on Patran and Frequency Domain Analysis under Random Vibration Load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 36(16): 202-206

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