Finite - element analysis for temperature-vibration coupled stress and strain of a microscale CSP solder joint

HUANG Chunyue1, HAN Lishuai1, LIANG Ying2,LI Tianming3,HUANG Genxin1

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Journal of Vibration and Shock ›› 2018, Vol. 37 ›› Issue (15) : 171-178.

Finite - element analysis for temperature-vibration coupled stress and strain of a microscale CSP solder joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 37(15): 171-178

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