Investigation of silicon wafer surface morphology and roughness processed&nbsp; by fixed abrasive polishing with assistance of ultrasonic vibration

Investigation of silicon wafer surface morphology and roughness processed by fixed abrasive polishing with assistance of ultrasonic vibration

FU Peng1, YANG Weiping1, WU Yongbo2

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Journal of Vibration and Shock ›› 2018, Vol. 37 ›› Issue (24) : 237-243.

Investigation of silicon wafer surface morphology and roughness processed by fixed abrasive polishing with assistance of ultrasonic vibration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 37(24): 237-243

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