Vibration analysis for lightweight and laminated electronic equipment

SHI Jinfeng,WANG Wei,XIA Siyu,XIN Wei

Journal of Vibration and Shock ›› 2019, Vol. 38 ›› Issue (19) : 155-160.

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PDF(1639 KB)
Journal of Vibration and Shock ›› 2019, Vol. 38 ›› Issue (19) : 155-160.

Vibration analysis for lightweight and laminated electronic equipment

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 38(19): 155-160

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