Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA

LU Liangkun1, HUANG Chunyue1, LIANG Ying2, LI Tianming3

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Journal of Vibration and Shock ›› 2019, Vol. 38 ›› Issue (21) : 221-228.

Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 38(21): 221-228

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