Thermal modal test of a C/SiC box structure
YU Kaiping1,ZHENG Bowen1,CHEN Xiaolan2,LI Xin2
Journal of Vibration and Shock ›› 2020, Vol. 39 ›› Issue (18) : 209-214.
Thermal modal test of a C/SiC box structure
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 | 〉 |