Vibration lifetime modelling of PBGA solder joints under random vibration loading

QIN Fei1,BIE Xiaorui1,CHEN Si2,AN Tong1

Journal of Vibration and Shock ›› 2021, Vol. 40 ›› Issue (2) : 164-170.

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PDF(1463 KB)
Journal of Vibration and Shock ›› 2021, Vol. 40 ›› Issue (2) : 164-170.

Vibration lifetime modelling of PBGA solder joints under random vibration loading

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 40(2): 164-170

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