Analysis and optimization of bending-vibration coupled stress and strain of micro-scale CSP solder joint

GAO Chao1, HUANG Chunyue1, LIANG Ying2, FU Yuxiang1, KUANG Bing1

Journal of Vibration and Shock ›› 2021, Vol. 40 ›› Issue (9) : 55-62.

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PDF(1885 KB)
Journal of Vibration and Shock ›› 2021, Vol. 40 ›› Issue (9) : 55-62.

Analysis and optimization of bending-vibration coupled stress and strain of micro-scale CSP solder joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 40(9): 55-62

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