The coupling stiffness between the internal modules of electronic equipment has a great impact on its dynamic characteristics. First, the vibration isolation theory of electronic equipment under the coupling condition was introduced. Then, taking the lead fracture of QFP component within an electronic equipment under vibration test as an example, the theoretical analyses of different coupling conditions were carried out, and availability of the vibration isolation theory was verified by finite element modal analysis. Finally, the vibration response of QFP was analyzed, and the fatigue life of component lead under different coupling conditions were calculated based on Palmgren-Miner’s cumulative damage theory, The analysis results were in good agreement with the product environmental test.
Key words
electronic equipment /
coupling stiffness /
QFP component /
fatigue life
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